HPE DL360 Gen11 8 SFF NC CTO Server · P52499-B21

Артикул базы CTO

P52499-B21

Описание точного SKU в HPE QuickSpecs

HPE DL360 Gen11 8 SFF NC CTO Server

Платформа данного QuickSpecs

HPE ProLiant DL360 Gen11

Trusted Supply Chain — опция

Optional: HPE Trusted Supply Chain for HPE ProLiant (P36394-B21)

Процессор по строке модели

Not included as standard.Optional: Quantity 1 or 2 (2 processors must be selected in 20EDSFF NC CTO Server)

Слоты DIMM — не установленная память

32-DIMM slots

Заглушки DIMM — правила охлаждения

DIMM Blanks are required, embedded, and shipped as default in all CTO Servers.Notes:– If Closed-loop Liquid Cooling or Direct (Open) Liquid Cooling modular is installed, and system memory is installed with any of the DIMM types among 16 GB, 32 GB, 96 GB or 128 GB, the DIMM Blanks must be removed.– If system memory is installed with 256 GB DIMM type, DIMM blanks will be installed as default, under both air cooling and Liquid Cooling configuration.

Контроллер хранения по строке модели

Choice of Intel® VROC Hybrid RAID capable.Choice of HPE ProLiant external hardware controllerChoice of HPE ProLiant Gen11 MR and SR PCIe and OCP plug-in Controller.

Слоты PCIe — поддержка и ограничения

Up to 3 Slots PCIe 5.0 (Slot 1, 2 and 3)One standard primary/butterfly riser: 2 slots as Slot 1 and Slot 2 (1 x16 FH / 1 x16 LP) and 4 x8 front NVMe connectorsOptional: Slot 3 in 1 x16 FH or LP slotAll PCIe Slots are in design with up to 9.5” length

Слоты OCP — с условиями модели

PCIe 5.0: 2 slots (1x16/ 1x16) 1

Корзина и backplane — состав и выбор

8 SFF – Optional backplanes. in choice of:- 24G x1 NVMe/SAS U.3, or- 24G x4 NVMe/SAS U.3,TriMode supported, must be selected if internal drives needed. Basic carrier (BC) support.(PCIe4.0 storage)

Сетевой контроллер по точному SKU

"BCM 5719 1Gb 4p BASE-T OCP Adapter" to be defaulted in the configurator at OCP Slot 21. Customers are allowed to remove and select other cards (PCIe of OCP) from Networking, InfiniBand, Smart IO (HW) or Storage Offload category.Choice of OCP3.0 or stand-up cards for primary networking selection plus additional/optional stand-up networking adapters.Notes:– No embedded networking from motherboard.– 1In 1 Processor configuration, “CPU1 to OCP2 x8 Enablement Kit” will be selected as default as OCP NIC is pre-selected at OCP Slot 2, to be defaulted in the configurator if 1 Processor is selected. Customers are allowed to remove if OCP NIC is not selected but needs to be replaced by a PCIe standup NIC. Meanwhile, the “CPU1 to OCP2 x8 Enablement Kit” will be removed.– 1“CPU2 to OCP2 x8 Enablement Kit” or “CPU2 to OCP2 x16 Enablement Kit” must be selected if OCP NIC is selected in 2 Processors configuration.– “CPU2 to OCP2 x8 Enablement Kit” to be defaulted in the configurator if 2 Processors are selected. Users should be allowed to remove “CPU2 to OCP2 x8 Enablement Kit” and should be forced select “CPU2 to OCP2 x16 Enablement Kit” if OCP NIC is selected. Customers are allowed to remove if OCP NIC is not selected but needs to be replaced by a PCIe standup NIC. Meanwhile, the “CPU2 to OCP2 x8 Enablement Kit” will be removed.– 2 In 20EDSFF CTO model, either no OCP enablement kit or “CPU2 to OCP2 x8 Enablement Kit” can be selected from the limited PCIe5.0 electrical lanes from OCP Slot 1 (x8) and OCP Slot2 (x8).

Вентиляторы — правила конфигурации

Choice of– 5 Standard Fans for one processor below 185W TDP.– Additional 2 Standard Fans for 2nd Processor below 185W TDP.– 7 High Performance Fans for processors 186W – 270W TDP.– 7 High Performance Fans for processors 300W TDP in one socket configuration.– Closed-loop Liquid Cooling (CL LC) Heat Sink Fan Bundle FIO Kit (7 fans included) for one or two processors above 271W TDP.– Direct Liquid Cooling (DLC) Heatsink and High-Performance Fan FIO solution, for all processors in 2P Configuration.Notes: If Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit is selected, there is default a FAN Kit bundled. Then any Fans (Standard Fan Kit or High-Performance Fan Kit) cannot be selected. In the CL LC bundle Kit, with full speed the Fan Kit runs at 210W, which requires 42W additional power than DL360 Gen11 Performance Fan Kit.

Управление и условия лицензирования

HPE iLO with Intelligent Provisioning (standard)HPE Compute Ops Management (a 3-year subscription included)Optional: iLO Advanced and OneView

Видеовыходы — штатные и опциональные

Rear: 1 VGAOptional:– 1 Front DisplayPort (standalone in 8 SFF; USB2.0+ DisplayPort bundle kit in 4 LFF).– 1 Rear Serial Port.

Порты USB

Front: 1 USB 3.2 Gen1 + iLO service port.Rear: 2 USB 3.2 Gen1.Internal: 1 USB 3.2 Gen1 + 1 USB2.0.Optional: 1 Front USB 2.0.

Безопасность — с условиями конфигурации

Trusted Platform Module (TPM) 2.0. It is an embedded feature and can be disabled in the BIOS setting.

Рельсы — состав / опция по документации

Optional Easy Install rails and CMA– HPE Easy Install Rail 3 Kit (P52341-B21) is available for 8SFF CTO Server if Rack is selected.– HPE Easy Install Rail 5 Kit (P52343-B21) is available for 4LFF and 20EDSFF CTO Server if Rail kit is selected.– HPE Cable Management Arm 4 for Friction Rail Kit (new CMA from Gen12); or– DL300 Gen10 Plus 1U CMA (P26489-B21) as optional. (If CMA is selected, then Rail Kit must be selected).Notes: Server does not support shelf mounted rail kits (“L” brackets).

Формфактор

1U Rack.

Тип заказа

Configure to order

Условия подбора

CTO — база для заказа: CPU, RAM, диски, адаптеры, PSU и охлаждение согласуются в конфигурации, не заявлены установленными. Варианты 4LFF, 8SFF и 20EDSFF имеют разные backplane/OCP/CPU-ограничения. Артикул из HPE QuickSpecs, а не обещание наличия или универсальной совместимости. До поставки сверяем точный SKU и суффикс, ревизию сервера, контроллеры, кабели, охлаждение, питание и состав заказа. Условия гарантии и поставки подтверждаются отдельно.

Источник характеристик: HPE ↗
Проверено по документации: 19.10.2026