Find equipment by part number or task. Specifications, compatibility checks and supply terms are on each product page.
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pending verificationMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 96 GB total · Modules per package: 4 · Package Memory Format: UDIMM
Photo pending verificationMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 96 GB total · Modules per package: 4 · Package Memory Format: CUDIMM
Photo pending verificationMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 96 GB total · Modules per package: 2 · Package Memory Format: SODIMM
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 96 GB total · Modules per package: 2
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 96 GB total · Modules per package: 2
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 96 GB total · Modules per package: 2
Photo pending verificationMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 96 GB total · Modules per package: 2
Specification schematic, not a product photograph or installation drawing.Server DDR5 memory with exact ordering SKU P43322-B21. Validate HPE configuration, prerequisites and shipment contents before ordering.
Specification schematic, not a product photograph or installation drawing.Server DDR5 memory with exact ordering SKU P43322-F21. Validate HPE configuration, prerequisites and shipment contents before ordering.
Specification schematic, not a product photograph or installation drawing.Server DDR5 memory with exact ordering SKU P50309-B21. Validate HPE configuration, prerequisites and shipment contents before ordering.
Specification schematic, not a product photograph or installation drawing.Server DDR5 memory with exact ordering SKU P50309-F21. Validate HPE configuration, prerequisites and shipment contents before ordering.
Reference catalogue for quotation requests. Availability, production status, condition, price, lead time and warranty are individually confirmed. A listed part number is not a stock claim.
Photo source and licence ↗For businesses in Tashkent and Uzbekistan: component selection, specification review and supply. Send the part number, quantity and host model for a quotation.
Check module type, DDR generation, module ECC, ranks, CPU limits and memory population rules. RDIMM, UDIMM, CUDIMM and SODIMM are not interchangeable. Actual speed depends on the platform.
