- CTO base part number
- P52498-B21
- Documented ordering description
- HPE DL360 Gen11 4 LFF NC CTO Server
- Documented platform
- HPE ProLiant DL360 Gen11
- HPE Trusted Supply Chain
- Optional: HPE Trusted Supply Chain for HPE ProLiant (P36394-B21)
- Processor
- Not included as standard.Optional: Quantity 1 or 2 (2 processors must be selected in 20EDSFF NC CTO Server)
- DIMM Slots
- 32-DIMM slots
- DIMM Blanks
- DIMM Blanks are required, embedded, and shipped as default in all CTO Servers.Notes:– If Closed-loop Liquid Cooling or Direct (Open) Liquid Cooling modular is installed, and system memory is installed with any of the DIMM types among 16 GB, 32 GB, 96 GB or 128 GB, the DIMM Blanks must be removed.– If system memory is installed with 256 GB DIMM type, DIMM blanks will be installed as default, under both air cooling and Liquid Cooling configuration.
- Storage Controller
- Choice of Intel® VROC Hybrid RAID capable.Choice of HPE ProLiant external hardware controllerChoice of HPE ProLiant Gen11 MR and SR PCIe and OCP plug-in Controller.
- PCIe Slots
- Up to 3 Slots PCIe 5.0 (Slot 1, 2 and 3)One standard primary/butterfly riser: 2 slots as Slot 1 and Slot 2 (1 x16 FH / 1 x16 LP) and 4 x8 front NVMe connectorsOptional: Slot 3 in 1 x16 FH or LP slotAll PCIe Slots are in design with up to 9.5” length
- OCP3.0 Slots
- PCIe 5.0: 2 slots (1x16/ 1x16) 1
- Drive Cage – included
- 4 LFF – default backplane.12G x1 SAS with Low Profile (LP) carrier support.
- Network Controller
- "BCM 5719 1Gb 4p BASE-T OCP Adapter" to be defaulted in the configurator at OCP Slot 21. Customers are allowed to remove and select other cards (PCIe of OCP) from Networking, InfiniBand, Smart IO (HW) or Storage Offload category.Choice of OCP3.0 or stand-up cards for primary networking selection plus additional/optional stand-up networking adapters.Notes:– No embedded networking from motherboard.– 1In 1 Processor configuration, “CPU1 to OCP2 x8 Enablement Kit” will be selected as default as OCP NIC is pre-selected at OCP Slot 2, to be defaulted in the configurator if 1 Processor is selected. Customers are allowed to remove if OCP NIC is not selected but needs to be replaced by a PCIe standup NIC. Meanwhile, the “CPU1 to OCP2 x8 Enablement Kit” will be removed.– 1“CPU2 to OCP2 x8 Enablement Kit” or “CPU2 to OCP2 x16 Enablement Kit” must be selected if OCP NIC is selected in 2 Processors configuration.– “CPU2 to OCP2 x8 Enablement Kit” to be defaulted in the configurator if 2 Processors are selected. Users should be allowed to remove “CPU2 to OCP2 x8 Enablement Kit” and should be forced select “CPU2 to OCP2 x16 Enablement Kit” if OCP NIC is selected. Customers are allowed to remove if OCP NIC is not selected but needs to be replaced by a PCIe standup NIC. Meanwhile, the “CPU2 to OCP2 x8 Enablement Kit” will be removed.– 2 In 20EDSFF CTO model, either no OCP enablement kit or “CPU2 to OCP2 x8 Enablement Kit” can be selected from the limited PCIe5.0 electrical lanes from OCP Slot 1 (x8) and OCP Slot2 (x8).
- Fans
- Choice of– 5 Standard Fans for one processor below 185W TDP.– Additional 2 Standard Fans for 2nd Processor below 185W TDP.– 7 High Performance Fans for processors 186W – 270W TDP.– 7 High Performance Fans for processors 300W TDP in one socket configuration.– Closed-loop Liquid Cooling (CL LC) Heat Sink Fan Bundle FIO Kit (7 fans included) for one or two processors above 271W TDP.– Direct Liquid Cooling (DLC) Heatsink and High-Performance Fan FIO solution, for all processors in 2P Configuration.Notes: If Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit is selected, there is default a FAN Kit bundled. Then any Fans (Standard Fan Kit or High-Performance Fan Kit) cannot be selected. In the CL LC bundle Kit, with full speed the Fan Kit runs at 210W, which requires 42W additional power than DL360 Gen11 Performance Fan Kit.
- Management
- HPE iLO with Intelligent Provisioning (standard)HPE Compute Ops Management (a 3-year subscription included)Optional: iLO Advanced and OneView
- Video Output
- Rear: 1 VGAOptional:– 1 Front DisplayPort (standalone in 8 SFF; USB2.0+ DisplayPort bundle kit in 4 LFF).– 1 Rear Serial Port.
- USB
- Front: 1 USB 3.2 Gen1 + iLO service port.Rear: 2 USB 3.2 Gen1.Internal: 1 USB 3.2 Gen1 + 1 USB2.0.Optional: 1 Front USB 2.0.
- Security
- Trusted Platform Module (TPM) 2.0. It is an embedded feature and can be disabled in the BIOS setting.
- Rail Kit
- Optional Easy Install rails and CMA– HPE Easy Install Rail 3 Kit (P52341-B21) is available for 8SFF CTO Server if Rack is selected.– HPE Easy Install Rail 5 Kit (P52343-B21) is available for 4LFF and 20EDSFF CTO Server if Rail kit is selected.– HPE Cable Management Arm 4 for Friction Rail Kit (new CMA from Gen12); or– DL300 Gen10 Plus 1U CMA (P26489-B21) as optional. (If CMA is selected, then Rail Kit must be selected).Notes: Server does not support shelf mounted rail kits (“L” brackets).
- Form Factor
- 1U Rack.
- Ordering type
- Configure to order
- Selection qualification
- CTO is an ordering base: CPU, RAM, drives, adapters, PSU and cooling are configured, not asserted installed. 4LFF, 8SFF and 20EDSFF differ in backplane/OCP/CPU requirements. An ordering SKU documented in HPE QuickSpecs, not an inventory or universal-compatibility promise. Verify exact SKU/suffix, server revision, controllers, cabling, cooling, power and shipment contents. Confirm warranty and supply individually.
Specification schematic, not a product photograph or installation drawing.
Specification schematic, not a product photograph or installation drawing.
Specification schematic, not a product photograph or installation drawing.
Specification schematic, not a product photograph or installation drawing.