Find equipment by part number or task. Specifications, compatibility checks and supply terms are on each product page.
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual sockets E (LGA-4677) 5th and 4th Gen Intel® Xeon® Scalable processors · Supported memory support: 16 DIMMs up to 4TB 3DS ECC DDR5-5600: RDIMM
Photo pending verificationServer platform: supported capabilities are not installed components. Configuration scope: Configurable platform / barebone reference; final factory BOM confirmed separately · Form factor: 2U rackmount · Memory platform support: 16 DDR5 DIMM slots; up to 4TB supported, not supplied
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP · Supported memory support: 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, up to 350W TDP (air cooled) · Supported memory support: Up to 2TB 6400MT/s ECC DDR5 RDIMM in 16 DIMM slots
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Per-node memory support: Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC · Per-node networking support: Flexible networking with OCP 3.0 AIOM slot
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Per-node memory support: Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC · Per-node networking support: Flexible networking with OCP 3.0 AIOM slot
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s · Supported expansion support: 4 PCIe 4.0 x16 Full Height (FH); 2 PCIe 4.0 x8 Full Height (FH)
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s · Supported expansion support: 4 PCIe 4.0 x16 Full Height (FH); 2 PCIe 4.0 x8 Full Height (FH)
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP · Supported memory support: 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
Photo pending verificationConfigurable server platform, not a fixed installed CPU/RAM/storage build. Per-node and shared resources remain separate on multi-node systems. Supported processor support: Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP · Supported memory support: 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
For replacing or extending installed Dell 13G hardware. Required condition and diagnostic checks are agreed separately.
An earlier-generation 2U platform for installed systems. Condition and configuration are checked before quoting.
For expanding DDR4 infrastructure and matching an installed fleet of 15G servers.
Model or product-family image. Configuration may differ.A 2U server for virtual machines, enterprise databases and applications, with project-specific storage and networking.
Model or product-family image. Configuration may differ.A 2U platform for new infrastructure: virtualization, databases and compute-intensive workloads.
Servers and upgrades for Gen9 infrastructure. Memory, SAS/SATA drives and mounting parts are matched to the exact model.
Expand an installed HPE fleet with a server or components matched to existing configurations and support requirements.
Model or product-family image. Configuration may differ.A flexible 2U platform for enterprise virtualization and business systems. Drives, memory and controllers follow an agreed specification.
Model or product-family image. Configuration may differ.A modern dual-socket 2U platform for consolidating enterprise applications and expanding compute capacity.
A compact option for dense server deployments; drive and expansion-card limits need checking.
For extending installed Lenovo systems. Condition and support availability require confirmation.
Rack server for virtualization and business applications; CPU, drives and expansion are configured to order.
A dual-socket platform for enterprise server refreshes, configured for applications and growth.
A platform for configurable server builds. Drives, networking and supplied components are defined in the quotation.
Reference catalogue for quotation requests. Availability, production status, condition, price, lead time and warranty are individually confirmed. A listed part number is not a stock claim.
Photo source and licence ↗For businesses in Tashkent and Uzbekistan: component selection, specification review and supply. Send the part number, quantity and host model for a quotation.
Distinguish a fixed configuration, CTO base and barebone. Supported maximum CPU, memory and drive counts are not installed components. Agree RAID, networking, power supplies, rails, licences and the final bill of materials separately.
